Accelerates wafer-level
packaging development, targets USD 30 million in the second year after
commencement
RRP Electronics Limited, a
leading player in the semiconductor industry and backed by cricket legend
Sachin Tendulkar, has entered into a strategic alliance with US-based Deca
Technologies, Inc. (Deca), to enhance its semiconductor capabilities. Under the
alliance, RRP Electronics – a firm focused on assembling and testing of
semiconductor components – will utilise Deca’s cutting-edge wafer-level
packaging solutions to enhance its semiconductor capabilities. RRP will
integrate Deca’s WLCSP and M-Series™ FOWLP technologies with the company’s
assembly and testing processes. Deca, a leading technology development and licensing
company in the advanced packaging industry, is backed by major industry
investors such as Qualcomm, Infineon, and ASE Group.
Currently, RRP is
collaborating on a high-profile project for a Swiss customer, focused on the
production of sophisticated ASICs in QFN packages, further demonstrating
commitment to excellence and innovation in the electronics sector.
Commenting on the alliance,
Rajendra K Chodankar, Chairman and CEO, RRP Electronics said, “We are prepared
to invest in a large-scale Technology Transfer License Agreement (TTLA) with
potential exclusive terms for the complete automated infrastructure and take
this alliance beyond horizons. The present infrastructure will also
significantly contribute to the Deca ecosystem. We envisage the set up
functional operations after a qualification test in August 2025. This
collaboration has the potential to generate revenue of over USD 30 million
(about ₹260 crore) in the second year of operation, with quantum jumps in
subsequent years.”
Tim Olson, Founder and CEO
of Deca said, “We are excited to be an integral part of India’s exciting
journey to become a prominent player in the growing global semi-conductor
industry. I am deeply impressed by the focus of the RRP Electronics team and
believe that the relationship with Deca will accelerate their ambitious plans.”
RRP Electronics is
developing Outsourced Semiconductor Assembly and Test (OSAT) initiative with a
total investment of ₹24,000 crore. The OSAT initiative aims to establish a
state-of-the-art semiconductor manufacturing and assembly facility in
Maharashtra. RRP Electronics is being supported by the Government of
Maharashtra to foster technological advancements and economic growth in the
region. In September 2024, RRP inaugurated its cutting-edge facility featuring
the latest in advanced manufacturing equipment. This project is expected to
create about 4,000 jobs, contributing significantly to the local economy and
positioning Maharashtra as a key player in the global semiconductor market.